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MB-EBR

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The MBRAUN Edge Bead Remover (MB-EBR) is specifically designed to solve the common problem of removing the boundaries of fully coated substrates. Cleaning the edges from organic layers is the prerequisite for an optimized subsequent encapsulation of the organic device. The removal process itself utilizes a high velocity solvent jet which is generated via the solvent jet nozzle. By directing the solvent jet towards the organic layer and moving the nozzle parallel to the substrate edge, a precise and accurate removal is achieved.

A custom exhaust system removes the organic debris immediately after it has been dissolved from the solvent jet, thus preventing any contamination of the remaining organic layer.

Special features include a self aligning and rotating substrate stage, a laser edge detection system, a fully PLC controlled process and the possibility to pre-define the width of the area to be removed. Different substrate sizes can be accommodated by replacing the substrate stage.

Please contact us if you have questions choosing the right edge bead remover for your specification needs.

Features

  • Edge bead removal for rectangular substrates
  • Selective removal of organic layers
  • Main control (PLC) with graphical user interface (GUI)
  • Recipe programmable solvent jet nozzle (speed, position)
  • Substrate top side solvent rinsing with solvent exhaust
  • Automatic edge detection

Options

Edge Bead Removers are available in various configurations for applications that range from research and development up to high volume manufacturing environments.

Edge Bead Removers are available in various configurations for applications that range from research and development up to high volume manufacturing environments.

Specifications

  • Process type: Solvent jet with integrated vacuum exhaust
  • Nozzle type: Solvent jet (no atomization)
  • Removable border area: ≤ 15 mm (adjustable)
  • Edge accuracy: ≤ ± 0.1 mm (depending on material)
  • Substrate alignment: Non-contact pre-alignment (laser sensor)

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MB-SC-ADV

Usually deployed in R&D and pilot scale systems spin coating is a common technique used to apply uniform thin films to flat substrates. Usually an excess amount of a solution is dispensed onto the substrate, which is then rotated at high speeds in order to spread the fluid uniformly by centrifugal force.

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